Measure layered images of samples using Tomography Inspection technology
Penetrating, layer-by-layer scanning of multi-layer structural elements using SSI's exclusive Tomography Inspection technology.
It is suitable for multi-layer structure inspection, material thickness, structural defects, surface flatness and other related requirements.
Applicable sample range：GaAs、LCD、Polished wafer with glue、Polished wafer、Rough wafer、Multiple pieces of glass、Multi-layer thin film、Wafer with tap、Glue with bubble、Wafer/polymer/glass plate、Molding compound on wafer。
GaAs Structure Scan
LCD defect judgment
Quartz oscillator double crystal failure