WLP(Wafer Level Package)

Size minimization, cost minimization, and performance maximization have become the common trends of consumer electronics as demand for portability and multi-functionality increase. With the ability to minimize mechanism size at a lower cost, wafer level package (WPL) has thus become a popular packaging method for microelectronics.
While chips are closely aligned at extremely small intervals, highly accurate adhesive ejection control is required. The Stream Jet piezoelectric jet dispenser and software has thus become a total solution for WLP underfilling.
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WLP Underfill