Tomography technology for non destructive measurement and inspection

SSI laser tomography technology is an advanced non contact nondestructive measurement and inspection technology able to detect the visual defects and structures as well as conduct measurement below the surface of materials. For semiconductor industry, it can be used to measure wafer thickness/ parallelism/void, adhesive thickness and checking cracks or voids during wafer thinning or bonding process in real time. It can be also used for glass thickness checking during thinning process or adhesive thickness measurement and distribution for touch panel lamination. Other applications are like multilayer film thickness inspection, structure uniformity and or homogeneity analysis or film coating thickness measurement. It can also be used to check OCA or OCR thickness inspection for touch panel lamination.

Non contact laser tomography technology