Solder Paste

The demand for smartphone and related wear applications continues to increase and challenge hardware specifications, making the MEMS (Micro Electro Mechanical Systems) component market increasingly demanding and must be miniaturized.

This drives fluid micro-packaging technology requirements. Which encapsulates the fluid control technology into the nl to pl level.

These technologies require a new generation of hardware and software control system to reach the fluid line width of 100um or less.

SSI® Stream Jet combines non-contact and contact technology with SSI's own advanced high-end motion control system and advanced coating imaging software technology to precisely apply less than 100um and minimum 30um fluid line widths to all fluid viscous coefficients of 0.1 cps to 1,000,000 cps in the required advanced MEMS packaging process.


MEMS Solder Paste