• Motion Mode

Motion Mode

For single-chip bonding or when there are only a few chips scattered at a longer distance, dispensing adhesive at different distances through simple speed control can achieve the task. For flip chips bonding at short distances, however, re-acceleration as in general dispensing processes will be a waste of time. The motion mode overcomes the limit of short-distance dispensing and speed control in empty runs to dispense and run at the same high speed. Overall dispensing speed can thus be enhanced by over 20%.


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