Micro Fluid and advanced packaging technology
VERSATILE DISPENSING APPLICATORS FOR ALL PRECISION APPLICATIONS
■ Piezo jet valve for high speed jetting
■ Progressive Cavity Pump (PCP) for precision high viscosity contact dispensing
■ Deposition pump for < 150 um dispensing
■ Solder paste jetting valve
■ Ultrasonic spray valve
■ High precision air spray valve
DISPENSING WITH AOI CAPABILITY
Specifications：
|
行程 X-Y-Z Max Travel |
580mm*620mm*50mm |
|
點膠行程 X-Y Dispensing Area |
420mm*360mm*50mm |
|
本體外觀尺寸 Dimensions |
1100mm(W)*1140mm(D)*1600mm(H) |
|
含周邊外觀尺寸Dimensions |
1200mm(W)*1300mm(D)*1900mm(H) |
|
重量 Robot Weight： |
1900 kg |
|
速度 XYZ Speed(mm/sec) |
1000, 1000, 250mm/sec |
|
加速度 XYZ Acceleration(mm/sec^2) |
0.5G, 0.5G, 0.25G |
|
反覆精度 Repeatability(XYZ ±um @3Sigma) |
1.5, 1.5, 3 |
|
位置精度 Position Accuracy(XYZ ±um @3Sigma) |
3, 3, 6 |
|
解析度 Resolution(XYZ um) |
0.5, 0.5, 0.5 |
|
X軸組成 |
龍門有鐵心線馬 |
|
Y軸組成 |
龍門雙軸有鐵心線馬 |
|
Z軸組成 |
400W伺服馬達，導程5mm螺桿 |
|
單輸送規格 |
重5KG, 寬最大520mm, 厚最大30mm |
|
雙輸送規格 |
重5KG, 寬最大220mm, 厚最大30mm |
|
Stage |
單站或3站真空加熱 |
HIGHEST ACCURACY IN THE MARKET
XLS is developed for micro fluid packaging process of which dispensing applications require extreme precision in repeatability and position accuracy . XSL has very high standards of ±3 um repeatability and ±6 um position accuracy and ±10 um jet dispensing accuracy as XSL gantry and machine chassis are designed through computer simulation and analysis to ensure a robust machine body with compact dimensions and light weight. XSL Z axis payload is as high as 15kg , which makes it capable to carry different dispensing tools, cameras, laser height sensors, curing device and etc for different process requirements.。
MOST ADVANCED DISPENSING SOFTWARE V2K
V2K is an unique software developed over a decade by SSI software team, which is capable to control the motion integrating intuitive vision teaching and alignment to achieve any desired dispensing pattern in a very high speed way.
Some of features include :
■ Alignment on fly
■ Dots on demand : synchronized motion and jetting speed, eliminating snake head phenome
■ Jetting on fly
■ Height detection on fly
■ 3D dispensing
■ Auto refill
Gluing and motion synchronous frequency conversion technology
The mini led packaging process includes using high-viscosity optical glue to separate the RGB chips, and then the glue completely covers the chip and fills the space of the dam separating the chips. In order to achieve the light emission effect, the glue separating the chips is staggered. The dots must maintain the same glue height. SSI not only has the ability of high-speed and high-precision glue coating, but also has the only piezoelectric glue spray technology that can control the consistent height of the staggered dots.
Glue filling of gaps in large panel splicing
When splicing large-area mini led panels, it is necessary to accurately fill the glue at the splicing point, and use the laser to detect the glue height at high speed and automatically fill the insufficient glue amount. SSI uses the self-developed image alignment technology to intercept the gap coordinates at high speed. And accurately fill the gap with glue and complete the function of automatic glue filling.
High-speed tin spraying
High-speed spraying of solder paste on glass or other substrates (the minimum tin spot is about 200μm), the maximum spraying speed is 720,000/hour.
