• Micro Fluid and advanced packaging technology

Micro Fluid and advanced packaging technology

Micro Fluid and advanced packaging technology
Model : XLS series

VERSATILE DISPENSING APPLICATORS FOR ALL PRECISION APPLICATIONS

■ Piezo jet valve for high speed jetting

■ Progressive Cavity Pump (PCP) for precision high viscosity contact dispensing

■ Deposition pump for < 150 um dispensing

■ Solder paste jetting valve

■ Ultrasonic spray valve

■ High precision air spray valve

DISPENSING WITH AOI CAPABILITY

Post dispensing AOI is becoming mandatory when assembly or packaging is becoming smaller and smaller so as dispensing patterns regardless dots/line/bead/curve. Recently some dispensing applications requested even less than 100um dot size. XSL machines has the option to use the same camera or link to a standard alone AOI machine to do post dispensing applications. SSI dispensing AOI is capable to inspect line width, dispensing height, air bubble, overflow, satellite.


stream-jet-in-line-machine.png

Specifications:

行程 X-Y-Z Max Travel
580mm*620mm*50mm
點膠行程 X-Y Dispensing Area
420mm*360mm*50mm
本體外觀尺寸 Dimensions
1100mm(W)*1140mm(D)*1600mm(H)
含周邊外觀尺寸Dimensions
1200mm(W)*1300mm(D)*1900mm(H)
重量 Robot Weight:
1900 kg
速度 XYZ Speed(mm/sec)
1000, 1000, 250mm/sec
加速度 XYZ Acceleration(mm/sec^2)
0.5G, 0.5G, 0.25G
反覆精度 Repeatability(XYZ ±um @3Sigma)
1.5, 1.5, 3
位置精度 Position Accuracy(XYZ ±um @3Sigma)
3, 3, 6
解析度 Resolution(XYZ um)
0.5, 0.5, 0.5
X軸組成
龍門有鐵心線馬
Y軸組成
龍門雙軸有鐵心線馬
Z軸組成
400W伺服馬達,導程5mm螺桿
單輸送規格
重5KG, 寬最大520mm, 厚最大30mm
雙輸送規格
重5KG, 寬最大220mm, 厚最大30mm
Stage
單站或3站真空加熱


HIGHEST ACCURACY IN THE MARKET

XLS is developed for micro fluid packaging process of which dispensing applications require extreme precision in repeatability and position accuracy . XSL has very high standards of ±3 um repeatability and ±6 um position accuracy and ±10 um jet dispensing accuracy as XSL gantry and machine chassis are designed through computer simulation and analysis to ensure a robust machine body with compact dimensions and light weight. XSL Z axis payload is as high as 15kg , which makes it capable to carry different dispensing tools, cameras, laser height sensors, curing device and etc for different process requirements.。

MOST ADVANCED DISPENSING SOFTWARE V2K

V2K is an unique software developed over a decade by SSI software team, which is capable to control the motion integrating intuitive vision teaching and alignment to achieve any desired dispensing pattern in a very high speed way. 

Some of features include :

■ Alignment on fly

■ Dots on demand : synchronized motion and jetting speed, eliminating snake head phenome

■ Jetting on fly

■ Height detection on fly

■ 3D dispensing

■ Auto refill

■ Dispensing volume auto adjustment according to the dispensing gap dimensions

Gluing and motion synchronous frequency conversion technology

The mini led packaging process includes using high-viscosity optical glue to separate the RGB chips, and then the glue completely covers the chip and fills the space of the dam separating the chips. In order to achieve the light emission effect, the glue separating the chips is staggered. The dots must maintain the same glue height. SSI not only has the ability of high-speed and high-precision glue coating, but also has the only piezoelectric glue spray technology that can control the consistent height of the staggered dots.

Glue filling of gaps in large panel splicing

When splicing large-area mini led panels, it is necessary to accurately fill the glue at the splicing point, and use the laser to detect the glue height at high speed and automatically fill the insufficient glue amount. SSI uses the self-developed image alignment technology to intercept the gap coordinates at high speed. And accurately fill the gap with glue and complete the function of automatic glue filling.

High-speed tin spraying

High-speed spraying of solder paste on glass or other substrates (the minimum tin spot is about 200μm), the maximum spraying speed is 720,000/hour.

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