SMT

Underfill

Flip-chip technology constantly advances. From PC applications in earlier times to mobile devices nowadays, as the size (chip distance) and bump height of chips are getting smaller, it requires multiple micro mass coatings to complete full underfilling. Extremely accurate ejection control and motion control software technology are thus required for multiple micro mass coatings at micro distances in order to reduce speed inconsistencies in adhesive ejection and transportation. The Stream Jet pi...

PCB Dispensing

The continuous development of miniaturization of consumer electronic products has led to increasingly shrinking Surface Mount Technology (SMT) components and higher density printed circuit boards (PCBs). In the current circuit board assembly process, to effectively handle these tiny and crowded components, a precise method is needed to spot a small point of material with the substrate to stick the components, and to complete the circuit bonding without causing Short circuit. The high-precision...