Semiconductor IC Packaging

Flip-chip Bonding

While minimization of chips and substrates is a natural process, more accurate epoxy coating for bonding substrates is required. The Stream Jet software can accurately coat epoxy on the substrate with its imaging technology.

WLP(Wafer Level Package)

Size minimization, cost minimization, and performance maximization have become the common trends of consumer electronics as demand for portability and multi-functionality increase. With the ability to minimize mechanism size at a lower cost, wafer level package (WPL) has thus become a popular packaging method for microelectronics. While chips are closely aligned at extremely small intervals, highly accurate adhesive ejection control is required. The Stream Jet piezoelectric jet dispenser and s...