MEMS Package

MEMS Wire Bonding

The demand for smartphone and related wear applications continues to increase and challenge hardware specifications, making the MEMS (Micro Electro Mechanical Systems) component market increasingly demanding and must be miniaturized. This drives fluid micro-packaging technology requirements. Which encapsulates the fluid control technology into the nl to pl level. These technologies require a new generation of hardware and software control system to reach the fluid line width of...

Ag, Au, Cu Pastes

The demand for smartphone and related wear applications continues to increase and challenge hardware specifications, making the MEMS (Micro Electro Mechanical Systems) component market increasingly demanding and must be miniaturized. This drives fluid micro-packaging technology requirements. Which encapsulates the fluid control technology into the nl to pl level. These technologies require a new generation of hardware and software control system to reach the fluid line width of...

UV Cure Resin

The demand for smartphone and related wear applications continues to increase and challenge hardware specifications, making the MEMS (Micro Electro Mechanical Systems) component market increasingly demanding and must be miniaturized. This drives fluid micro-packaging technology requirements. Which encapsulates the fluid control technology into the nl to pl level. These technologies require a new generation of hardware and software control system to reach the fluid line width of 1...

Solder Paste

The demand for smartphone and related wear applications continues to increase and challenge hardware specifications, making the MEMS (Micro Electro Mechanical Systems) component market increasingly demanding and must be miniaturized. This drives fluid micro-packaging technology requirements. Which encapsulates the fluid control technology into the nl to pl level. These technologies require a new generation of hardware and software control system to reach the fluid line width of...