SSI laser tomography technology encompasses the following key advantages
. Most advanced 3rd generation tomography
. Advanced fiber laser technology
. Flexible fiber guided probe
. Customized laser scanning system
. Total process solution provider
INDUSTRIAL OPTICAL COHERENT TOMOGRAPHY
The trend of wafer thinning is obvious and fast particularly for 3D wafer . Look at the records between 2015 to 2021, MEMS wafer thickness from 370~250um to 100um, ASIC MEMS from 100~150 um to 100 um, memories from 50um to 18um, Logics from 50um to 28um and power device from 60~110um to 60um. It is crucial for silicon manufacturing that precision polished wafer keeps uniform thickness and parallelism to ensure good quality bonding to the 2nd wafer. To achieve the above goal, the proper technology which is able check voids/cracks and measure the thickness, parallelism, adhesive thickness in real time becomes essential for wafer manufacturing. SSI offers the updated advanced tomography technology to help silicon wafer manufacturers to be able to solve the problem of real time measuring wafer thickness and related problems.