• Extreme high speed dot dispensing technology

Extreme high speed dot dispensing technology

Extreme high speed dot dispensing technology
Model : HL series

FAST DOT DISPENSING MACHINE

In SMT filed the trend of increasing miniaturized chip components and chips mounted on PCB or flexible substrate is inevitable. To meet the trend, the industry needs a more advanced dispensing platform for higher speed and accuracy to increase productivity and reduce rejects. Over the last more than two decades, SSI has been dedicating to develop the most advanced dispensing technology to improve the dispensing efficiency and yield. The HL series jetting machine by SSI is aimed to to fulfill the need of extreme high speed and accuracy for dot dispensing. HL series is specifically designed for applications which customers are having looking applications jetting millions of dot of SMT glue or solder paste in a crowded area with the requirement of high precision repeatability accuracy and high throughput.

MOST STRINGENT MACHINE SPECIFICATIONS

HL series has a special design to eliminate mechanical deformation and stress with very light weight gantry but very robust machine chassis to be able to run at 3G acceleration and 2000 mm/sec.

■ Highest speed in the world for dot dispensing up to 2.8 million dots /hr

■ Highest repeatability accuracy ±1um
■ Extreme high acceleration capabilities higher than 3G for high speed short distance dot dispensing
■ Large working area up to 630 mm x 680mm (XY)

MOST ADVANCED DISPENSING VISION SOFTWARE
■ CAD file input and dispensing route auto editing and optimization
■ Fast global alignment for panelized PCB
■ Intuitive user interface for quick direct teaching
■ SSI exclusive vision algorithms and image filters for critical vision alignment
■ Synchronized dispensing and motion speed to ensure the consistent dispensing
height at the start, the end and the crossing point.
■ Automatic dispensing weight measurement and calibration
■ Fiducial on fly
■ Height detection on fly for 3D dispensing
■ Remote teaching
■ 5 axis motion control on Z axis
■ Post dispensing AOI
VERSATILE DISPENSING APPLICATORS FOR ALL PRECISION APPLICATIONS
■Piezo jet valve for high speed jetting
■ Progressive Cavity Pump (PCP) for precision high viscosity contact dispensing
■ Deposition pump for < 100 um dispensing
■ Solder paste jetting valve
■ Thin film ultrasonic spray coater
■ 10:1 high precision mixing and dispensing
■ High precision air spray coater

hl-series.png

Specifications:

行程 X-Y-Z Max Travel
630mm*680mm*100mm
點膠行程 X-Y Dispensing Area
510mm*510mm*50mm
本體外觀尺寸 Dimensions
1440mm(W)*1450mm(D)*1600mm(H)
含周邊外觀尺寸 Dimensions
2066mm(W)*1450mm(D)*1600mm(H)
重量 Robot Weight:
1700 kg
速度 XYZ Speed(mm/sec)
2000, 2000, 250mm/sec
加速度 XYZ Acceleration(mm/sec^2)
3G, 3G, 0.25G
反覆精度 Repeatability(XYZ ±um @3Sigma)
2, 2, 5
位置精度 Position Accuracy(XYZ ±um @3Sigma)
4, 4, 10
解析度 Resolution(XYZ um)
0.2, 0.2, 0.2
X軸組成
龍門單軸有鐵心線馬
Y軸組成
龍門單軸有鐵心線馬
Z軸組成
進馬達,導程8mm螺桿
單輸送規格
重5KG, 寬最大520mm, 厚最大30mm
雙輸送規格
重5KG, 寬最大220mm, 厚最大30mm
Stage
單站真空加熱

SMT Applications 

SMT ADHESIVE & SOLDER PASTE HIGH SPEED JETTING
HL series is designed to be able to jet SMT adhesive and solder paste at very high speed and high accuracy on a very high density SMT board. Also thanks to SSI smart CAD file down load feature, customers can save lots of time editing dispensing routes.

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