Dispenser Manufacturer

Dispenser Manufacturer -SAMURAI SPIRIT INC.

Manufacturer of micro dispensing Robots. If you are looking for high precision, low viscosity, automatic or non-contact dispensing equipment, welcome to contact us.

Micro Fluid and advanced packaging technology

Gluing and motion synchronous frequency conversion technology The packaging process of Mini led includes using high-viscosity technology optical glue to separate the RGB chips, and then the glue is finished. Fully cover the wafer and fill the space of the dam that separates the wafer, and the glue that separates the wafer for the light emission effect It is necessary to maintain the same glue height at the staggered point. SSI not only has the ability of high-speed and high-precision glue ...

Advanced 5 axis robot for 3D packaging

Model AX5 series is the most advanced dispensing robot for applications which can not be achieved by normal 3 axis robots + 2 extra XY axison the stage. Z axis on model AX5 series is able to control vertical movement but also theta rotation and tilt angel all by the software. Intuitivefriendly user interface enable users to set up the machine simply setting XYZ coordinates and dispensing angel, the program will automaticallycalculate the final dispensing position and precisely complete th...

Advanced micro-precision coating machine: semiconductor packaging / high-speed solder paste injection / ultra-fine dots < 100 um

SL series is specifically designed for semiconductor micro fluid packaging applications for narrow gap filling, fine line dispensing and micro underfill with small machine footprint and aggressive price. SL has outstanding performance of motion route repeatability and accuracy, capable to precisely fill silver epoxy into 170um narrow gap as well as precisely dispense 0.2 nl material in total volume along the dispensing route whatever it is line, square, circle or any other shapes. SL series is...

Advanced laser machining technology for silicon / composite materials/ ceramic / glass

When products are getting smaller, thinner, l ighter and more compact, laser micro machining for silicon, glass, ceramic, flex circuits, composite materials, thin film, , metal, and plastic is commonly used to meet challenges for micro holes, via, grooving, trenching, cutting, marking and direct writing as it is precise, fast, flexible, non destructive. However, laser micro machining is a sophisticated process which combines laser source, optical beam path design, precision motion control, vis...

Advanced hybrid bonder : Dispensing/IJP + Die attach + assembly + inspection

Die bonding is the process of attaching the die either to its package or some substrate. A good die bonding process needs to be precisely aligned before place on the right pad. It also needs perfect contact between the die and the substrate without void. To achieve the perfect contact, the bonding head design must be able to aligned freely for the coplanarity. Because the die is weak and brittle, a fine tuning bonding force capability is mandatory to avoid destroying the die duringbonding ...

State of the art 3D ink jet printing technology

Background of ink jet printing technology Ink jet printing technology has been commonly used for commercial applications for decades . However , Ink jet printing technology just started attracting attentions for industrial applications due to very high accuracy pico liter drop volume and drop placement precision for functional materials such as light blocking ink, conductive ink and UV adhesive for advanced manufacturing like OLED, sensors, Black matrix, semiconductor mini/micro led and PC...

Tomography technology for non destructive measurement and inspection

SSI laser tomography technology is an advanced non contact nondestructive measurement and inspection technology able to detect the visual defects and structures as well as conduct measurement below the surface of materials. For semiconductor industry, it can be used to measure wafer thickness/ parallelism/void, adhesive thickness and checking cracks or voids during wafer thinning or bonding process in real time. It can be also used for glass thickness checking during thinning process or adhesi...