Advanced semiconductor micro dispensing platform
FOR SIP / WAFER LEVEL MINI UNDERFILL / EXTREME FINE SILVER PASTE DISPENSING PATH / NARROW GAP FILLING
SL series is specifically designed for semiconductor micro fluid packaging applications for narrow gap filling, fine line dispensing and micro underfill with small machine footprint and aggressive price. SL has outstanding performance of motion route repeatability and accuracy, capable to precisely fill silver epoxy into 170um narrow gap as well as precisely dispense 0.2 nl material in total volume along the dispensing route whatever it is line, square, circle or any other shapes. SL series is designed to be able to accept up to 12' wafer for extreme precision dispensing and repeated dispensing path accuracy regardless dot, line or curve shape.
SL series has a special machine base and gantry designed by SSI research team with software simulation to meet the highest repeatability accuracy of ±1um and position accuracy of ±2um for the goal of lower budget and highest performance.
VERSATILE DISPENSING APPLICATORS FOR ALL PRECISION APPLICATIONS DIFFERENT
Piezo jet valve for high speed jetting
Progressive Cavity Pump (PCP) for precision high viscosity contact dispensing
Deposition pump for < 100 um dispensing
■ Support SECS / GEM and mapping requirements
■ Close loop flow volume control
Automatically checking the dispensing volume on micro scale, monitoring, auto adjusting and evenly distribute the dispensing volume alone the dispensing route
POST DISPENSING PRECISION AUTOMATIC OPTICAL INSPECTION
SL series also supports post glue inspection after dispensing for any kind of glue and substrate background to eliminate the cost from defective dispensing as a result of customized algorithms and software modification for individual process. SSI unique glue inspection capability is completely different from competitors approach using available standard vision solution in the market, which often ends with high percentage of false inspection and creates defects. SL series customized vision inspection capability can assure 98-99 % detection rate after dispensing process and increases overall yield.
With all above hardware, software and vision capabilities, system option for conveyor with tray, cassette, magazine, wafer cassette and FOP.
Specifications：
|
行程 X-Y-Z Max Travel |
500mm*700mm*100mm |
|
點膠行程 X-Y Dispensing Area |
400mm*500mm*100mm |
|
本體外觀尺寸 Dimensions |
840mm(W)*1300mm(D)*1510mm(H) |
|
含周邊外觀尺寸 Dimensions |
900mm(W)*1540mm(D)*1700mm(H) |
|
重量 Robot Weight： |
1700 kg |
|
速度 XYZ Speed(mm/sec) |
500, 500, 250mm/sec |
|
加速度 XYZ Acceleration(mm/sec^2) |
0.25G, 0.25G, 0.25G |
|
反覆精度 Repeatability(XYZ ±um @3Sigma) |
1, 1, 3 |
|
位置精度 Position Accuracy(XYZ ±um @3Sigma) |
2, 2, 6 |
|
解析度 Resolution(XYZ um) |
0.1, 0.1, 0.1 |
|
X軸組成 |
龍門單軸有鐵心線馬 |
|
Y軸組成 |
龍門單軸有鐵心線馬 |
|
Z軸組成 |
100W伺服馬達，螺桿導程5mm |
|
單輸送規格 |
重5KG, 寬最大520mm, 厚最大30mm |
|
雙輸送規格 |
重5KG, 寬最大220mm, 厚最大30mm |
|
Stage |
單站真空加熱(3站真空加熱需外置加熱站) |
SL series has a special machine base and gantry designed by SSI research team with software simulation to meet the highest repeatability accuracy of ±1um and position accuracy of ±2um for the goal of lower budget and highest performance.
VERSATILE DISPENSING APPLICATORS FOR ALL PRECISION APPLICATIONS DIFFERENT
Piezo jet valve for high speed jetting
Progressive Cavity Pump (PCP) for precision high viscosity contact dispensing
Deposition pump for < 100 um dispensing
■ Support SECS / GEM and mapping requirements
■ Close loop flow volume control
Automatically checking the dispensing volume on micro scale, monitoring, auto adjusting and evenly distribute the dispensing volume alone the dispensing route
POST DISPENSING PRECISION AUTOMATIC OPTICAL INSPECTION
SL series also supports post glue inspection after dispensing for any kind of glue and substrate background to eliminate the cost from defective dispensing as a result of customized algorithms and software modification for individual process. SSI unique glue inspection capability is completely different from competitors approach using available standard vision solution in the market, which often ends with high percentage of false inspection and creates defects. SL series customized vision inspection capability can assure 98-99 % detection rate after dispensing process and increases overall yield.
With all above hardware, software and vision capabilities, system option for conveyor with tray, cassette, magazine, wafer cassette and FOP.
SL applications
SL series is specifically designed for semiconductor micro fluid packaging applications for narrow gap filling, fine line dispensing and micro underfill with small machine footprint and aggressive price. SL has outstanding performance of motion route repeatability and accuracy, capable to precisely fill silver epoxy into 170um narrow gap as well as precisely dispense 0.2 nl material in total volume along the dispensing route whatever it is line, square, circle or any other shapes. SL series is designed to be able to accept up to 12' wafer for extreme precision dispensing and repeated dispensing path accuracy regardless dot, line or curve shape.
