• Advanced semiconductor micro dispensing platform
  • Advanced semiconductor micro dispensing platform

Advanced semiconductor micro dispensing platform

Advanced semiconductor micro dispensing platform
Model : SSL series

FOR SIP / WAFER LEVEL MINI UNDERFILL / EXTREME FINE SILVER PASTE DISPENSING PATH / NARROW GAP FILLING

SL & SSL series is specifically designed for semiconductor micro fluid packaging applications for narrow gap filling, fine line dispensing and micro underfill with small machine footprint and aggressive price. SL & SSL has outstanding performance of motion route repeatability and accuracy, capable to precisely fill silver epoxy into 170um narrow gap as well as precisely dispense 0.2 nl material in total volume along the dispensing route whatever it is line, square, circle or any other shapes.

SL & SSL series is designed to be able to accept up to 12' wafer for extreme precision dispensing and repeated dispensing path accuracy regardless dot, line or curve shape.

SSL basically has similar features as SL except higher acceleration up to 2.5G for high throughput requirements. However, SL will be the better choice for filling silver epoxy in 200um.

EXTREMELY HIGH PRECISION HARDWARE SPECIFICATIONS

SL series has a special machine base and gantry designed by SSI research team with software simulation to meet the highest repeatability accuracy of ±1um and position accuracy of ±2um for the goal of lower budget and highest performance.

VERSATILE DISPENSING APPLICATORS FOR ALL PRECISION APPLICATIONS DIFFERENT

 Piezo jet valve for high speed jetting
 Progressive Cavity Pump (PCP) for precision high viscosity contact dispensing
 Deposition pump for < 100 um dispensing

 Solder paste jetting valve
 Thin film ultrasonic spray coater
 10:1 high precision mixing and dispensing
 High precision air spray


MOST ADVANCED DISPENSING VISION SOFTWARE WITH MOTION CONTROL
SSI vision software is the most advanced dispensing software integrating motion control and vision alignment with the following features :

■ Support SECS / GEM and mapping requirements
■ Close loop flow volume control
  Automatically checking the dispensing volume on micro scale, monitoring, auto adjusting and evenly distribute the dispensing volume alone the dispensing route

■ Quick process parameters setting

  Just set up single chip dispensing parameters then the software can duplicate the same parameters on all chips on the wafer

■ Effective dispensing delay time control
  Underfill takes time to diffuse, with only few chip delay time parameters, V2K can automatically calculate the proper dispensing delay time for all chip on the wafer
■ Stream motion
  A dot to dot control technology, which synchronize dispensing frequency and the motion speed enabling the uniform dispensing result regardless acceleration, deceleration or turning
■ Real time dispensing height measurement and compensation
■ Fiducial on fly
  Integrated vision capabilities for auto alignment and optical inspection for 2D and 3D
■ Remote teaching
  Engineers can remotely teach the robot without sitting in front of the machine

POST DISPENSING PRECISION AUTOMATIC OPTICAL INSPECTION
SL series also supports post glue inspection after dispensing for any kind of glue and substrate background to eliminate the cost from defective dispensing as a result of customized algorithms and software modification for individual process. SSI unique glue inspection capability is completely different from competitors approach using available standard vision solution in the market, which often ends with high percentage of false inspection and creates defects. SL series customized vision inspection capability can assure 98-99 % detection rate after dispensing process and increases overall yield.
With all above hardware, software and vision capabilities, system option for conveyor with tray, cassette, magazine, wafer cassette and FOP.

Specifications:

行程 X-Y-Z Max Travel
410mm*640mm*40mm
點膠行程 X-Y Dispensing Area
320mm*440mm*40mm
本體外觀尺寸 Dimensions
700mm(W)*1571mm(D)*1603mm(H)
含周邊外觀尺寸 Dimensions
1379mm(W)*1714mm(D)*1730mm(H)
重量 Robot Weight:
700 kg
速度 XYZ Speed(mm/sec)
1500, 1500, 50mm/sec
加速度 XYZ Acceleration(mm/sec^2)
1.5G, 1.5G, 0.25G
反覆精度 Repeatability(XYZ ±um @3Sigma)
1, 1, 3
位置精度 Position Accuracy(XYZ ±um @3Sigma)
2, 2, 6
解析度 Resolution(XYZ um)
0.1, 0.1, 0.1
X軸組成
倒吊單軸有鐵心線馬
Y軸組成
倒吊單軸有鐵心線馬
Z軸組成
步進馬達,導程8mm螺桿
單輸送規格
重5KG, 寬最大520mm, 厚最大30mm
雙輸送規格
重5KG, 寬最大220mm, 厚最大30mm
Stage
單站真空加熱(3站真空加熱需外置加熱站)
MOST ADVANCED DISPENSING VISION SOFTWARE WITH MOTION CONTROL
SSI vision software is the most advanced dispensing software integrating motion control and vision alignment with the following features :

■ Support SECS / GEM and mapping requirements
■ Close loop flow volume control
  Automatically checking the dispensing volume on micro scale, monitoring, auto adjusting and evenly distribute the dispensing volume alone the dispensing route

■ Quick process parameters setting

  Just set up single chip dispensing parameters then the software can duplicate the same parameters on all chips on the wafer

■ Effective dispensing delay time control
  Underfill takes time to diffuse, with only few chip delay time parameters, V2K can automatically calculate the proper dispensing delay time for all chip on the wafer
■ Stream motion
  A dot to dot control technology, which synchronize dispensing frequency and the motion speed enabling the uniform dispensing result regardless acceleration, deceleration or turning
■ Real time dispensing height measurement and compensation
■ Fiducial on fly
  Integrated vision capabilities for auto alignment and optical inspection for 2D and 3D
■ Remote teaching
  Engineers can remotely teach the robot without sitting in front of the machine

POST DISPENSING PRECISION AUTOMATIC OPTICAL INSPECTION
SL series also supports post glue inspection after dispensing for any kind of glue and substrate background to eliminate the cost from defective dispensing as a result of customized algorithms and software modification for individual process. SSI unique glue inspection capability is completely different from competitors approach using available standard vision solution in the market, which often ends with high percentage of false inspection and creates defects. SL series customized vision inspection capability can assure 98-99 % detection rate after dispensing process and increases overall yield.
With all above hardware, software and vision capabilities, system option for conveyor with tray, cassette, magazine, wafer cassette and FOP.

FOR SIP / WAFER LEVEL MINI UNDERFILL / EXTREME FINE SILVER PASTE DISPENSING PATH / NARROW GAP FILLING

SL & SSL series is specifically designed for semiconductor micro fluid packaging applications for narrow gap filling, fine line dispensing and micro underfill with small machine footprint and aggressive price. SL & SSL has outstanding performance of motion route repeatability and accuracy, capable to precisely fill silver epoxy into 170um narrow gap as well as precisely dispense 0.2 nl material in total volume along the dispensing route whatever it is line, square, circle or any other shapes.

SL & SSL series is designed to be able to accept up to 12' wafer for extreme precision dispensing and repeated dispensing path accuracy regardless dot, line or curve shape.

SSL basically has similar features as SL except higher acceleration up to 2.5G for high throughput requirements. However, SL will be the better choice for filling silver epoxy in 200um.

Related Products

Micro Fluid and advanced packaging technology
More

Micro Fluid and advanced packaging technology

Advanced dispensing desk top robot
More

Advanced dispensing desk top robot

Advanced true 5 axis dispensing robots
More

Advanced true 5 axis dispensing robots