Advanced Process Solutions
1
Mini / Micro led packaging technology
2
Advanced 5 axis robot for 3D packaging
3
Advanced micro dispensing robots for semiconductor packaging / high speed solder paste jetting / extreme micro dots < 100 um
4
Advanced laser machining technology for silicon / composite materials/ ceramic / glass
5
Advanced hybrid bonder : Dispensing/IJP + Die attach + assembly + inspection
6
State of the art 3D ink jet printing technology
7
Tomography technology for non destructive measurement and inspection
Our Products
Fluid Dispensing Systems and Equipment
Detail
Fluid Dispensing Systems and Equipment
Die bonding machine and coating system
Detail
Die bonding machine and coating system
Non contact laser tomography technology
Detail
Non contact laser tomography technology
Laser Processing System
Detail
Laser Processing System
AOI System
Detail
AOI System
Inkjet Printing
Detail
Inkjet Printing
Versatile Custom System
Detail
Versatile Custom System
Applications
Panel Dispensing Technology
SMT
Solder Paste Application
Semiconductor IC Packaging
LED Dispensing Package
Lens Module Assembly
Two-Component Epoxy Mixing
MEMS Package
Extreme Narrow-frame (HMA)
EMI Coating
ASDV technology
News
2022
Sep 19
2022 SEMICON Taiwan (September 14-16, Nangang Exhibition Hall)
2022
Jun 20
2022 Touch Taiwan Series Exhibition - Smart Display Exhibition
2022
Jan 19
2021 SEMICON Taiwan (December 28-30, Nangang Exhibition Hall)
2019
Feb 01
Productronica China 2019 (March 20-22, 2019)
2019
Jan 16
2019 NEPCON JAPAN (Jan. 16-18 Tokyo Big Sight, Japan)
News
10-1F,No.21,Section 6,Zhongxiao East Road,Nangang District,Taipei City
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