Advanced process solutions
- 1Mini / Micro led packaging technology :Mass transfer + laser repair
- 2Advanced 5 axis robot for 3D packaging
- 3Advanced micro dispensing robots for semiconductor packaging / high speed solder paste jetting / extreme micro dots < 100 um
- 4Advanced laser machining technology for silicon / composite materials/ ceramic / glass
- 5Advanced hybrid bonder : Dispensing/IJP + Die attach + assembly + inspection
- 6State of the art 3D ink jet printing technology
- 7Tomography technology for non destructive measurement and inspection
Technology capabilities
- 1Vertical core technologies integration including circuit design - embedded motion control - imaging processing - vision algorithms- SECS GEM ( Own library)/CIM - sub micro precision mechanism design.
- 2Customization capabilities for high level process development integrating motion control / precision dispensing / optic design / precision laser control / die attach / AOI technologies.
- 3Industry 4.0 automation development including SECS GEM(Own library)/CIM.
Imaging Software Technology
Product Profile
Application Solutions
Latest News
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- 2022-06-202022 Touch Taiwan Series Exhibition - Smart Display Exhibition
- 2022-02-182021 SEMICON Taiwan (December 28-30, Nangang Exhibition Hall)
- 2019-02-01Productronica China 2019 (March 20-22, 2019)
- 2019-01-062019 NEPCON JAPAN (Jan. 16-18 Tokyo Big Sight, Japan)
- 2018-01-252018 FINETECH JAPAN (12/5-12/7 Makuhari Messe)
- 2018-01-252018 SEMICON Taiwan (9/5-7 Taipei Nangang Exhibition Center)
- 2018-01-242018 Touch Taiwan (8/29-8/31 TWTC Nanggang)
- 2018-01-242018 Taipei int'l Industrial Automation Exhibition
- 2018-01-24Productronica China 2018 (March 14 – 16, 2018)
- 2018-01-092018 NEPCON JAPAN (Jan. 17-19 Tokyo Big Sight, Japan)
- 2017-11-14Productronica 2017
- 2017-08-282017 Motek International trade fair for automation in production and assembly
- 2017-08-242017 Touch Taiwan (9/20-9/22 TWTC NangGang)
- 2017-02-152017 SEMICON Taiwan (9/13-15 Taipei Nangang Exhibition Center)
- 2017-02-1521th M-Tech JAPAN (June 21-23 2017 Tokyo)
- 2017-02-1327th NEPCON China (April 25-27, 2017 Shanghai)
- 2017-02-1527th FINETECH JAPAN (Apr.5-7 2017 Tokyo)
- 2016-11-172017 INTERNEPCON JAPAN (1/18~1/20 Tokyo Big Sight)
- 2016-11-102016 C-TOUCH & DISPLAY SHENZHEN (11/24 ~ 11/26 Shenzhen Convention & Exhibition Center)
- 2016-11-102016 Japan N-PLUS (9/28-9/30 Tokyo Bigsight Area East 3Hall K-18)
- 2016-11-102016 Touch Taiwan (8/24-8/26 TWTC NangGang)

